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| 序號(hào) | 測(cè)試項(xiàng)目 | 縮寫(xiě) | 樣品數(shù)/批 | 批數(shù) | 測(cè)試方法 |
| 1 | Pre- and Post-Stress Electrical and Photometric Test | TEST | 所有應(yīng)力試驗(yàn)前后均進(jìn)行測(cè)試 | 用戶(hù)規(guī)范 | |
| 2 | Pre-conditioning | PC | SMD產(chǎn)品在WHTOL、TC、PTC試驗(yàn)前預(yù)處理 | JESD22-A113 | |
| 3 | External Visual | EV | 每項(xiàng)試驗(yàn)前后均進(jìn)行測(cè)試，除DPA和尺寸測(cè)試 | JESD22-B101 | |
| 4 | Parametric Verification | PV | 25 | 3 Note A | 用戶(hù)規(guī)范 |
| 5a | High Temperature Operating Life | HTOL1 | 26 | 3 Note B | JESD22-A108 |
| 5b | High Temperature Operating Life | HTOL2 | 26 | 3 Note B | JESD22-A108 |
| 5c | High Temperature Reverse Bias | HTRB | 26 | 3 Note B | JESD22-A108 |
| 6a | Wet High Temperature Operating Life | WHTOL1 | 26 | 3 Note B | JESD22-A101 |
| 6b | Wet High Temperature Operating Life | WHTOL2 | 26 | 3 Note B | JESD22-A101 |
| 6c | High Humidity High Temperature Reverse Bias | H3TRB | 26 | 3 Note B | JESD22-A101 |
| 7 | Temperature Cycling | TC | 26 | 3 Note B | JESD22-A104 |
| 8a | Power Temperature Cycling | PTC | 26 | 3 Note B | JESD22-A105 |
| 8b | Intermittent Operational Life | IOL | 26 | 3 Note B | MIL-STD-750-1 Method 1037 |
| 9 | Low Temperature Operating Life | LTOL | 26 | 3 Note B | JESD22-A108 |
| 10a | Electrostatic Discharge Human Body Model | HBM | 10 | 3 | JS-001 |
| 10b | Electrostatic Discharge Charged Device Model | CDM | 10 | 3 | AEC Q101-005 |
| 11 | Destructive Physical Analysis | DPA | 2/試驗(yàn) | 1 | Appendix 6 |
| 12 | Physical Dimension | PD | 10 | 3 | JESD22-B100 |
| 13 | Terminal Strength | TS | 10 | 3 | MIL-STD-750-2 Method 2036 |
| 14 | Constant Acceleration | CA | 10 | 3 | MIL-STD-750-2 Method 2006 |
| 15 | Vibration Variable Frequency | VVF | JEDEC JESD22-B103 | ||
| 16 | Mechanical Shock | MS | JEDEC JESD22-B104 | ||
| 17 | Hermeticity | HER | JESD22-A109 | ||
| 18a | Resistance to Solder Heat | RSH (-reflow) | 10 | 3 | 含鉛：JESD22-A113、J-STD-020 |
| 無(wú)鉛：AEC-Q005 | |||||
| 18b | Resistance to Solder Heat | RSH (-wave) | 10 | 3 | 含鉛：JESD22-B106 |
| 無(wú)鉛：AEC-Q005 | |||||
| 19 | Solderability | SD | 10 | 3 | 含鉛：J-STD-002、JESD22-B102 |
| 無(wú)鉛：AEC-Q005 | |||||
| 20 | Pulsed Operating Life | PLT | 26 | 3 | JESD22-A108 |
| 21 | Dew | DEW | 26 | 3 | JESD22-A100 |
| 22 | Hydrogen Sulphide | H2S | 26 | 3 | IEC 60068-2-43 |
| 23 | Flowing Mixed Gas | FMG | 26 | 3 | IEC 60068-2-60 Test method 4 |
| 24 | Thermal Resistance | TR | 10 | 1 | JESD51-50、JESD51-51、JESD51-52 |
| 25 | Wire Bond Pull | WBP | 10 | 3 | MIL-STD-750-2 Method 2037 |
| 26 | Wire Bond Shear | WBS | 10 | 3 | AEC Q101-003 |
| 27 | Die Shear | DS | 5 | 3 | MIL-STD-750-2 Method 2017 |
| 28 | Whister Growth | WG | / | / | AEC Q005 |
